PRODUCTS

KRI Ion Sources

System Overview

Developed by Dr. Kaufman
KRI Ion Sources for everything from cleaning to thin film deposition

We sell and install KRI ion sources from the United States, developed by Dr. Kaufman. Compatible with a wide range of applications such as cleaning, sputtering, and etching.

The Kaufman Ion Source and Dr. Harold Kaufman

At the core of our ion beam system is the Kaufman-type ion source, a technology shaped by one of the field’s most influential figures, founder Dr. Harold Kaufman.

Dr. Harold Kaufman

Building on his research at NASA, Dr. Kaufman developed the Kaufman-type broad ion source, which came to be used not only in aerospace, but also widely across the electrical and electronics industries as an ion source for ion beam etching and ion beam sputtering.

Earned a Ph.D. from Colorado State University in 1971
Served as chair of the Department of Physics at Colorado State University from 1978 until his retirement
Retired from the university in 1984 and founded Kaufman & Robinson, Inc.

Dr. Kaufman was inducted into the NASA Glenn Research Center Hall of Fame in 2016. NASA recognized the founder of KRI as a trailblazer of ion propulsion, stating that he had “the rare distinction of inventing an experimental spaceflight hardware system that has not only been demonstrated in testing but is being used in space flights today.”

Ion Source Types and Features

KRI ion sources can be selected according to the application and the required process environment.

End-Hall Ion Sources

Uses	Ideal for ultra-high voltage, high-current ion beam processes such as IAD and pre-cleaning. Enables low-damage etching, cleaning, and ion-assisted deposition.
Features	High-current assisted effect improves the optical properties. HCES enables extended oxygen beam-assisted irradiation. Water cooling supports low-temperature deposition processes, and retrofit installation on existing system is straightforward.
Industries Used	Optics, laser facets, optical communication filters, and quantum devices.

Gridded Ion Sources

Uses	Used for etching, sputtering, and pre-cleaning applications. Used for high-quality optical film deposition and etching (milling) of magnetic materials and metal films.
Features	Plasma is confined within the ion source, achieving low contamination and an operating vacuum in the 10⁻²Pa range. Plasma discharge mode can be selected as DC or RF.

Gridded RF Ion Sources

Model	RFICP40	RFICP100	RFICP140	RFICP220	RFICP380
Beam Current (mA)	>100	>350	>600	>800	>1,000
Beam Voltage (V)	100～1200	100～1200	100～1200	100～1200	100～1200
Beam Output Diameter	4cmφ	10cmφ	14cmφ	20cmφ	38cmφ
Length (cm)	12.7	23.5	24.6	30	39
Outer Diameter (cm)	13.5	19.1	24.6	41	59
Mounting Flange	8″CF	10″CF	12″CF	12″CF	12″CF

Gridded DC Ion Sources

Model	KDC10	KDC40	KDC75	KDC100	KDC160
Beam Current (mA)	>10	>100	>250	>400	>650
Beam Voltage (V)	100～1200	100～1200	100～1200	100～1200	100～1200
Beam Output Diameter	1cmφ	4cmφ	8cmφ	12cmφ	16cmφ
Length (cm)	11.5	17.1	20.1	23.5	25.2
Outer Diameter (cm)	4	9	14	19.4	23.2
Mounting Flange	2-3/4″CF	6″CF	8″ or 10″CF	10″ or 12″CF	12″CF

KRI DC Power Supplies

DC Power Supply

Performance	· 3000W power supply for pulsed DC · 0 to 1000V, 10A max
Features	· Arc detection in under 100ns, 1μs recovery time · Reverse voltage adjustable up to 150V · Variable operating frequency, ultra-low arc energy

Non-Pulsed DC Power Supply

Performance	· Up to 1500W power supply for pulsed DC · 0 to 1000V, 4A max
Features	· Arc detection in under 200ns, 1μs recovery time · Superior arc detection performance · Ultra-low arc energy

Electron Sources

We offer electron sources that complement ion beam processes.
These system are designed for electron emission.

Electron Sources

Performance and Industries Used	· Ion engine development · MPD thruster development · Mountable on all ion source types
Type	· Hollow cathode type · Built-in filament type · RF type

Product	SHC1000 (selective uses)	MHC1000	LHC1000	LFN2000
Type	Hollow cathode	Hollow cathode	Hollow cathode	Low AC Frequency
Plasma coupling	Yes	Yes	Yes	Yes
IE max	5A	10A	20A	1A
VB	< 50eV	< 50eV	< 50eV	< 50eV
Insert life*	100 to 500 hrs	200 to 800 hrs	200 to 1000 hrs	200 to 600 hrs
Typical flows (Ar)	5-10sccm	5-10sccm	5-20sccm	4-6sccm
Width	1.51”	2.3”	2.3”	2.3”
Length	2.85”	3.6”	4.6”	1.65”
Mounting	Internal remote	Internal remote	Internal remote	Internal remote
Installations	eH, RFICP, KDC, anode layer, cathodes, thrusters	eH, RFICP, KDC, anode layer, cathodes, thrusters	eH, RFICP, KDC, anode layer, cathodes, thrusters	RFICP, KDC, anode layer, cathodes
Process	Etch, Deposition, Space	Etch, Deposition, Space	Etch, Deposition, Space	Etch, Deposition